CPU INTEL chladič pro socket 1155 (Thin Mini ITX) - HTS1155 LP

Podrobnosti

http://cache-www.intel.com/cd/00/00/49/20/492064_492064.pdf

Contents of the Retail Packaged Thermal Solution

1.Heat exchanger (with attached 4x PIM screws and 2x chassis screws pre-attached)

2.Backplatewith adhesive

3.Blower with 4 pin connector (PWM controlled)

4.Blower to chassis attach screws 2x in clean plastic bag

5.TIM pillow pack (not pre-applied)

6.Instruction manual

System Requirements

1.Must be a THIN Mini-ITX board as the heat sink requires the CPU to be in a specific location

Note: NOT compatible with Regular Mini-ITX boards

2.LGA1155 socket based board with the standard desktop 75x75 mm heat sink attach hole pattern

3.Supports LGA1155 socket based CPUs up to 65 W

Specifications: